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S1130
Pressure-Sensitive Hot Melt Glue
LEDAR-S1130 is a pressure-sensitive hot melt adhesive, it offers excellent peel strength and provides strong bonding performance under both high and low temperatures. Additionally, compared to conventional pressure-sensitive hot melt adhesives, it delivers superior thermal stability.
Advantage
Viscosity: 8,000–10,000 cps (@185°C)
Softening Point: 125°C–135°C
Typical Performance
Viscosity:
- 180℃ approximately 12000cps
- 185℃ approximately 9000cps
- 190℃ approximately 7000cps
Packaging Specification: 24 kg/box
Main applications
Suitable for high-performance single-sided/double-sided film or foam bonding applications.
Typical Applications
Qualification
TEL/whatsapp：+8618863956798
FAX：+86-532-86622521
E-mail：ru.zhang@cimc.com
ADD：Haier Industry park Jiaozhou,Qingdao,Shangdong,P.R.China
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